TIN SOLDER WITHOUT FLUX FOR INST. OF COPPER FI 2.00 250G PCS | SOLDERING
  • TIN SOLDER WITHOUT FLUX FOR INST. OF COPPER FI 2.00 250G PCS | SOLDERING

TIN SOLDER WITHOUT FLUX FOR INST. OF COPPER FI 2.00 250G PCS



C-D6 2 250
€ 21.29 per pcs.
Quantity


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Condition: new product
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   Austria    Austria    23.57 €
   Belgium    Belgium    23.57 €
   Czechia    Czechia    23.57 €
   France    France    23.57 €
   Germany    Germany    21.72 €
   Hungary    Hungary    23.57 €
   Latvia    Latvia    21.72 €
   Lithuania    Lithuania    21.72 €
   Netherlands    Netherlands    23.57 €
   Poland    Poland    3.45 €
   Romania    Romania    23.57 €
   Slovakia    Slovakia    23.57 €

Description
TECHNICAL DATA:
Wire diameter: 2.0
Capacity [g]: 250




Solders Tin-based lead-free alloys are mainly used in electronics, electrical engineering and construction.

These are most often alloys of the Sn-Ag-Cu, Sn-Cu and Sn-Ag types with the content of alloying elements up to several%. These alloys are most often used where the presence of lead in the binder is undesirable or prohibited. />
Lead-free filler metals ensure good weld quality. These alloys are characterized by a slightly higher melting point (by about 30°C) and slightly worse wetting of soldered surfaces than Sn-Pb alloys.

The use of appropriate fluxes, however, significantly improves the soldering process and the quality of the weld.

Silver as an alloying element in lead-free solders increases the rate of wetting and improves resistance to thermal fatigue.

The addition of Cu improves the soldering of electrical connections.

Reference photo



EAN: 1000001072524
Tag: TIN, SOLDER, WITHOUT, MBO SOLDER, WELDING AND SOLDERING SOLDERING .
Product Details
C-D6 2 250
4 pcs.
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