TIN SOLDER WITH FLUX FI 1.50 250G PCS | SOLDERING
  • TIN SOLDER WITH FLUX FI 1.50 250G PCS | SOLDERING

TIN SOLDER WITH FLUX FI 1.50 250G PCS



C-D60 15 250
€ 16.96 per pcs.
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Description
TECHNICAL DATA:
Wire diameter: 1.5
Capacity [g]: 250




Sn alloys -Pb are soft binders used mainly in the electrotechnical, construction and machine industries. These are mostly two-component alloys. The most popular Sn-Pb alloys contain 30, 40, 60, 63, 90% tin.

Small additions of Sb, Cu and Ag alloys slightly change the characteristics of the alloy, which broadens the scope of application of these alloys.

They are used as soft binders for soldering metal elements, soldering electrical connections, tinning small elements in mechanical engineering, for hot-dip soldering of elements.

Physical and chemical properties

Finding agents these ensure good wetting of soldered surfaces.

Sb, sometimes added as an alloying element in the amount of up to several %, is used to harden the alloy.

The addition of Ag improves fatigue strength and creep strength, especially in at higher temperatures.

The addition of Cu improves the soldering of electrical connections.

The table below contains the properties of the basic alloys

MBO flux: RL- Dependent in electronics. Modified rosin with very low chloride content.
Suitable for soldering a wide range of materials. Low-corrosive with a neutral, mild odor and excellent performance. Excellent wetting, good soldering speeds. Moderately active.

Reference photo



EAN: 1000001078823
Tag: TIN, SOLDER, WITH, MBO SOLDER, WELDING AND SOLDERING SOLDERING .
Product Details
C-D60 15 250
20 pcs.
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