TIN SOLDER WITHOUT FLUX FOR INST. OF COPPER FI 3.00 250G PCS

TECHNICAL DATA:
Wire diameter: 3.0
Capacity [g]: 250




Solders Tin-based lead-free alloys are mainly used in electronics, electrical engineering and construction.

These are most often alloys of the Sn-Ag-Cu, Sn-Cu and Sn-Ag types with the content of alloying elements up to several%. These alloys are most often used where the presence of lead in the binder is undesirable or prohibited. />
Lead-free filler metals ensure good weld quality. These alloys are characterized by a slightly higher melting point (by about 30°C) and slightly worse wetting of soldered surfaces than Sn-Pb alloys.

The use of appropriate fluxes, however, significantly improves the soldering process and the quality of the weld.

Silver as an alloying element in lead-free solders increases the rate of wetting and improves resistance to thermal fatigue.

The addition of Cu improves the soldering of electrical connections.

Reference photo



EAN: 1000001797991
Tag: TIN, SOLDER, WITHOUT, MBO SOLDER, WELDING AND SOLDERING SOLDERING